Showing posts with label Electronics And Communication Engineering. Show all posts
Showing posts with label Electronics And Communication Engineering. Show all posts

28 June 2015

Thinnest bulb in the world

On 6/28/2015
Scientists have demonstrated, for the first time, an on-chip visible light source using graphene as a filament. They attached small strips of graphene to metal electrodes, suspended the strips above the substrate, and passed a current through the filaments to cause them to heat up. This was achieved by James Hone’s group at Columbia Engineering, a team of scientists from Columbia University, Seoul National University (SNU), and Korea Research Institute of Standards and Science (KRISS), led by Young Duck Kim, a postdoctoral research scientist.

Wang Fon-Jen professor of mechanical engineering at Columbia Engineering and co-author of the study said that “We’ve created what is essentially the world’s thinnest light bulb,”.“This new type of ‘broadband’ light emitter can be integrated into chips and will pave the way towards the realization of atomically thin, flexible, and transparent displays, and graphene-based on-chip optical communications" he added.

For developing fully integrated “photonic” circuits, creating light in small structures on the surface of a chip is crucial. In spite of huge amount of efforts from researchers, they still haven't developed, a way to put the oldest and simplest artificial light source the incandescent light bulb onto a chip. This is because of the reason that light bulb filaments must be extremely hot nearly thousands of degrees Celsius in order to glow in the visible range but micro-scale metal wires cannot withstand such temperatures, in addition to that heat transfer from the hot filament to its surroundings is extremely efficient at the microscale, which makes such structures impractical and leads to damage of the surrounding chip.


By measuring the spectrum of the light emitted from the graphene, the team was able to show that the graphene was reaching temperatures of above 2,500 C, hot enough to glow brightly. Kim, first and co-lead author on the paper said “The visible light from atomically thin graphene is so intense that it is visible even to the naked eye, without any additional magnification,”.


Interestingly, the spectrum of the emitted light showed peaks at specific wavelengths, which the team discovered was due to interference between the light emitted directly from the graphene and light reflecting off the silicon substrate and passing back through the graphene. Kim notes, “This is only possible because graphene is transparent, unlike any conventional filament, and allows us to tune the emission spectrum by changing the distance to the substrate.”

As graphene heats up, it becomes a much poorer conductor of heat. This means that the high temperatures stay confined to a small “hot spot” in the center, due to this property graphene is able to achieve high temperatures without melting the substrate or the metal electrodes. Myung-Ho Bae, a senior researcher at KRISS and co-lead author said " At the highest temperatures, the electron temperature is much higher than that of acoustic vibrational modes of the graphene lattice, so that less energy is needed to attain temperatures needed for visible light emission,”.“These unique thermal properties allow us to heat the suspended graphene up to half of the temperature of the sun, and improve efficiency 1000 times, as compared to graphene on a solid substrate," he added.



Yun Daniel Park, professor in the Department of Physics and Astronomy at Seoul National Univ. and co-lead author, notes that they are working with the same material that Thomas Edison used when he invented the incandescent light bulb: “Edison originally used carbon as a filament for his light bulb and here we are going back to the same element, but using it in its pure form—graphene—and at its ultimate size limit—one atom thick.”

The group is currently working to further characterize the performance of these devices—for example, how fast they can be turned on and off to create “bits” for optical communications—and to develop techniques for integrating them into flexible substrates.



Hone adds, “We are just starting to dream about other uses for these structures—for example, as micro-hotplates that can be heated to thousands of degrees in a fraction of a second to study high-temperature chemical reactions or catalysis.”

Source: R&D Magzine







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15 June 2015

What is a Digital Oscilloscopes??

On 6/15/2015
Oscilloscopes are one of the basic requirement for any individual or firm involved with electronics. An oscilloscope which is also called as scope, is a type of electronic test equipment that allows signal voltages to be viewed, usually as a 2-D graph of one or more electrical potential differences (vertical axis) plotted as a function of time or of some other, voltage (horizontal axis).

It is a device with a wide array of uses, but mainly used to measures electrical signals, these signals are then represented in an interpretable and measurable format. For years, analogue oscilloscopes have provided this function. In modern times though, the more technologically advanced digital oscilloscope has replaced it.

Oscilloscopes

A digital oscilloscope (DSO) depicts the electrical signals in the form of a graphical illustration.A DSO measures the signal, and then converts that measurement into a digital format using an ADC converter, after which the data measured is depicted as a digital waveform representation. A large variety of oscilloscopes are available in a range of sizes from the more traditional bench oscilloscopes to lightweight, portable oscilloscopes which are usually battery powered. 

DSO have a wider range of functions than their analog counterparts which includes the ability to not just measure waveforms, but display them, store them, provide waveform processing, analysis and more. In general, DSO comes equipped with multiple input slots too, which allows the oscilloscope to make simultaneous readings of different devices simultaneously.

Applications of digital oscilloscopes
Due to their flexibility and resourcefulness, digital oscilloscopes are used in a variety of vocations and industries. Here are some of the applications of oscilloscopes.
  • Oscilloscopes are used in the automotive field to assess the amount of vibrations a vehicle is causing, which helps the mechanic or manufacturer determine how effective the damping on the vehicle is, or if there are any structural defects.
  • Another popular use of oscilloscopes is to measure seismic activity such as earthquakes, tremors and the shifting of seismic plates. Scientists and researchers working in the study of seismology find use for digital oscilloscopes regularly.
  • In the world of music and sound, oscilloscopes are used to calculate the vibrating frequency and strength of sound waves. This helps them to determine the quality and reach of the audio, and is used in a variety of scenarios such as live shows, audio recording, television 
  • Oscilloscopes also find function in the area of electricity and electronics. The quality and proficiency of power-based machines and systems are measured using oscilloscopes. Digital oscilloscopes are also used to trouble shoot such devices, as it can determine if there are issues in the flow of electricity within the devices.
  • The most widely recognized use of an oscilloscope is in ECG or electrocardiography machines. Commonly seen in hospitals and used to measure the patient’s heart-rate, ECG machines are also used on pregnant women to measure the heartbeat of their infants.
The price of a DSO depends upon its functionality. The more high-end devices such as 6 GHz oscilloscopes and above can be quite expensive to purchase new, and can be rented from electronics test and measurement suppliers like Tektronix, TRS RenTelco, Rohde & Schwarz, Teledyne LeCroy, Keysight and others who offer rent, lease and sale options on this equipment. Although, trade of used digital oscilloscopes also occurs across the nation, meaning cheaper, second-hand alternatives can be found based on the buyer’s budget.
Source: R&D Magzine




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18 February 2015

GATE Syllabus For Electronics And Communication (ECE or EXTC)

On 2/18/2015

MATHEMATICS

Calculus: Mean value theorems, Theorems of integral calculus, Evaluation of definite and improper integrals, Partial Derivatives, Maxima and minima, Multiple integrals, Fourier series. Vector identities, Directional derivatives, Line, Surface and Volume integrals, Stokes, Gauss and Green’s theorems.
Complex variables: Analytic functions, Cauchy’s integral theorem and integral formula, Taylor’s and Laurent’ series, Residue theorem, solution integrals.
Linear Algebra: Matrix Algebra, Systems of linear equations, Eigen values and eigen vectors.
Differential equations: First order equation (linear and nonlinear), Higher order linear differential equations with constant coefficients, Method of variation of parameters, Cauchy’s and Euler’s equations, Initial and boundary value problems, Partial Differential Equations and variable separable method.
Numerical Methods: Solutions of non-linear algebraic equations, single and multi-step methods for differential equations.
Transform Theory: Fourier transform,Laplace transform, Z-transform.
Differential equations: First order equation (linear and nonlinear), Higher order linear differential equations with constant coefficients, Method of variation of parameters, Cauchy’s and Euler’s equations, Initial and boundary value problems, Partial Differential Equations and variable separable method.
Probability and Statistics: Sampling theorems, Conditional probability, Mean, median, mode and standard deviation, Random variables, Discrete and continuous distributions, Poisson,Normal and Binomial distribution, Correlation and regression analysis.


ELECTRONICS AND COMMUNICATION ENGINEERING

Electromagnetics: Elements of vector calculus: divergence and curl; Gauss’ and Stokes’ theorems, Maxwell’s equations: differential and integral forms. Wave equation, Poynting vector. Plane waves: propagation through various media; reflection and refraction; phase and group velocity; skin depth. Transmission lines: characteristic impedance; impedance transformation; Smith chart; impedance matching; S parameters, pulse excitation. Waveguides: modes in rectangular waveguides; boundary conditions; cut-off frequencies; dispersion relations. Basics of propagation in dielectric waveguide and optical fibers. Basics of Antennas: Dipole antennas; radiation pattern; antenna gain.

Communications: Random signals and noise: probability, random variables, probability density function, autocorrelation, power spectral density. Analog communication systems: amplitude and angle modulation and demodulation systems, spectral analysis of these operations, superheterodyne receivers; elements of hardware, realizations of analog communication systems; signal-to-noise ratio (SNR) calculations for amplitude modulation (AM) and frequency modulation (FM) for low noise conditions. Fundamentals of information theory and channel capacity theorem. Digital communication systems: pulse code modulation (PCM), differential pulse code modulation (DPCM), digital modulation schemes: amplitude, phase and frequency shift keying schemes (ASK, PSK, FSK), matched filter receivers, bandwidth consideration and probability of error calculations for these schemes. Basics of TDMA, FDMA and CDMA and GSM.

Control Systems: Basic control system components; block diagrammatic description, reduction of block diagrams. Open loop and closed loop (feedback) systems and stability analysis of these systems. Signal flow graphs and their use in determining transfer functions of systems; transient and steady state analysis of LTI control systems and frequency response. Tools and techniques for LTI control system analysis: root loci, Routh-Hurwitz criterion, Bode and Nyquist plots. Control system compensators: elements of lead and lag compensation, elements of Proportional-Integral-Derivative (PID) control. State variable representation and solution of state equation of LTI control systems.

Signals and Systems: Definitions and properties ofLaplace transform, continuous-time and discrete-time Fourier series, continuous-time and discrete-time Fourier Transform, DFT and FFT, z-transform. Sampling theorem. Linear Time-Invariant (LTI) Systems: definitions and properties; causality, stability, impulse response, convolution, poles and zeros, parallel and cascade structure, frequency response, group delay, phase delay. Signal transmission through LTI systems.

Digital circuits: Boolean algebra, minimization of Boolean functions; logic gates; digital IC families (DTL, TTL, ECL, MOS, CMOS). Combinatorial circuits: arithmetic circuits, code converters, multiplexers, decoders, PROMs and PLAs. Sequential circuits: latches and flip-flops, counters and shift-registers. Sample and hold circuits, ADCs, DACs. Semiconductor memories. Microprocessor(8085): architecture, programming, memory and I/O interfacing.

Networks: Network graphs: matrices associated with graphs; incidence, fundamental cut set and fundamental circuit matrices. Solution methods: nodal and mesh analysis. Network theorems: superposition, Thevenin and Norton’s maximum power transfer, Wye-Delta transformation. Steady state sinusoidal analysis using phasors. Linear constant coefficient differential equations; time domain analysis of simple RLC circuits, Solution of network equations usingLaplace transform: frequency domain analysis of RLC circuits. 2-port network parameters: driving point and transfer functions. State equations for networks.
Electronic Devices: Energy bands in silicon, intrinsic and extrinsic silicon. Carrier transport in silicon: diffusion current, drift current, mobility, and resistivity. Generation and recombination of carriers.p-n junction diode, Zener diode, tunnel diode, BJT, JFET, MOS capacitor, MOSFET, LED, p-I-n and avalanche photo diode, Basics of LASERs. Device technology: integrated circuits fabrication process, oxidation, diffusion, ion implantation, photolithography, n-tub, p-tub and twin-tub CMOS process.
Analog Circuits: Small Signal Equivalent circuits of diodes, BJTs, MOSFETs and analog CMOS. Simple diode circuits, clipping, clamping, rectifier.Biasing and bias stability of transistor and FET amplifiers. Amplifiers: single-and multi-stage, differential and operational, feedback, and power. Frequency response of amplifiers.Simple op-amp circuits. Filters. Sinusoidal oscillators; criterion for oscillation; single-transistor and op-amp configurations.Function generators and wave-shaping circuits, 555 Timers. Power supplies.

Related posts:GATE syllabus CE , GATE syllabus for ME , GATE syllabus for CH . GATE syllabus for Civil

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4 January 2015

Electronics and Communication engineering(ECE or EXTC) opportunities

On 1/04/2015

ELECTRONICS AND COMMUNICATION

The job profile of these engineers will generally involve setting up networks and equipments, process and maintenance of electronics gears and systems etc. Hardware firms like IBM as well as communication network firms like Nokia Siemens also take in EC or EXTC graduates in plenty. Top notch IT firms also prefer EC or EXTC graduates for software engineering jobs. 


An electronics engineer works in groups to design, fabricate, produce, test and supervise the manufacturing of complex products and systems i.e. electronic equipment and components. They work with microprocessors, fiber optics, telecommunication, television, radios etc.

Electronics and Communication Products and Solutions are used in various industries across the world. Major Industries which offer Jobs for ECE engineers are:


  • Electronics Circuit Design
  • Signal processing
  • Wireless Communication
  • Optical Communication
  • Robotics
  • Embedded Systems
  • Analog electronics
  • Digital electronics
  • Telecommunications
  • Power Electronics
  • Consumer Electronics
  • Solid State Physics
  • Control systems
  • VLSI
  • Defense
  • Nanotechnology
  • Mobile Companies 

TOP Companies which offer JOBS for ECE engineers are


  • Texas Instruments
  • Intel
  • AMD
  • CISCO
  • IBM
  • Samsung Electronics
  • Sony
  • Toshiba
  • Philips Semiconductors
  • Nokia
  • Nvdia
  • HP
  • LG Electronics
  • Bharat Heavy Electrical's Limited (BHEL)
  • Electronics Corporation of India Limited (ECIL)
  • National Thermal Power Corporation (NTPC)
  • Wipro
  • HCL
  • ISRO
  • SYNTEL
  • WIPRO

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